Japanese researchers have developed a breakthrough MRAM fabrication method using thulium iron garnet (TmIG) — a material known for ultra-fast, low-power data rewriting at room temperature.
By applying a mass-producible on-axis sputtering technique, the team created high-quality TmIG films with a thin platinum layer that enables efficient data writing using minimal electric current.
The result? A potential revolution in AI and high-performance computing hardware — offering faster speeds, lower energy consumption, and greater scalability for next-gen processors.
If scaled, this could make AI data centers dramatically more efficient, cutting both power costs and heat generation, two of the biggest bottlenecks in modern compute infrastructure.
Simply put — Japan is cooking, and this discovery could help power the next leap in energy-efficient AI computing.
